Back to homepage Dow Premium Sponsor at TAPPI 2017

Dow Packaging is once again the premium sponsors of this year’s TAPPI global extrusion coating PLACE conference, which is to be hosted in Basel, Switzerland May 22-24.

Dow will be presenting a broad range of innovative solutions aligned to our marketing strategic priorities: AGILITY based blends for much faster and lighter coatings with good conversion efficiency; new clean sealants for improved conversion and packaging efficiency; and the new barrier adhesive for recyclable medium barrier laminates plus SYMBIEX, among other key innovations. We will participate in an innovation corner, with a speech to reinforce our broad portfolio.

TAPPI is a high profile and technical conference so the main audience will be Technical and R&D Managers, and we expect to see attendees from our key customers Tetra, Elopak, SIG, Mondi, Constantia, Amcor, Walki and MetsaBoard.

Discover more about what is happening at TAPPI.